图片仅供参考，见产品说明
SMDLTLFP250T4
| 制造商: | Chip Quik, Inc. |
|---|---|
| 产品类别: | Solder |
| 数据表: | SMDLTLFP250T4 |
| 描述: | SOLDER PASTE LOW TEMP T4 250G |
| RoHS状态: | 通过无铅认证 |
| 属性 | 属性值 |
|---|---|
| 制造商 | Chip Quik, Inc. |
| 产品类别 | Solder |
| 形式 | Jar, 8.8 oz (250g) |
| 类型 | Solder Paste |
| 系列 | - |
| 过程 | Lead Free |
| 直径 | - |
| 流量类型 | No-Clean |
| 保质期 | 6 Months, 2 Months |
| 线规 | - |
| 作文 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| 部分状态 | Active |
| 熔点 | 281°F (138°C) |
| 航运信息 | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Digi-Key存储 | Refrigerated |
| 货架期开始 | Date of Manufacture |
| 存储/制冷温度 | 37°F ~ 46°F (3°C ~ 8°C) |
